Technological Empire Starts From Shanzhai System

There was a burst of heated discussions and sensations at the scene, and people were shocked by the words that a chip the size of a fingernail had a wire length of tens of thousands of meters.

In this regard, Lin Xuan slowly raised his hand again, making a silent movement.

People who saw Lin Xuan's actions also closed their mouths, so Lin Xuan said slowly:

"Presumably everyone has also learned the concept of resistance, knowing that the longer one of the wires is, the greater the resistance will be.

Although these wires are actually not connected together, but divided into sections, this does not prevent the fact that he is actually equivalent to a long wire.

In the past, if you were wondering why a small chip can reach a super power of 65 watts, 90 watts or even 120W.

Then you can reduce your curiosity by half now, because you only need to think about the fact that there are metal wires equivalent to tens of thousands of meters in a chip the size of a fingernail.

Then you know how big the resistance of this thing is, and where most of the heat on the chip comes from. "

Hearing Lin Xuan's words, the people at the scene nodded one after another.

At this point they understood where most of the heat in the chip came from.

The answer is without a doubt.

The heat source of the chip is not only the heat emitted by the transistor when it is running, but also the metal wire is definitely a big contributor to the heat!

After all, according to their understanding, when current passes through a conductor, it will generate heat. At this time, just think about the tens of thousands of meters of wires in a chip the size of a fingernail.

Then you know that the heat emitted by a wire equivalent to tens of thousands of meters in length cannot be ignored!

"We have developed cobalt interconnection technology before, and this cobalt interconnection technology is not pure high-purity cobalt, but a special cobalt alloy.

This cobalt alloy has better thermal conductivity and lower electrical resistance than single crystal copper.

So we can use cobalt interconnect technology to create chips with more cores, and eventually we can plug more transistors to defeat more advanced manufacturing processes.

But now we can sweep cobalt interconnection technology and copper interconnection technology into the history pile, because we have developed carbon metal wire interconnection technology! "

Hearing Lin Xuan's words, the people at the scene looked at Lin Xuan curiously.

They have just learned that the conductivity of this wire called carbon metal is second only to that of superconductors, but they don't know what the actual effect is?

Although Lin Xuan just said a bunch of technical terms, he said the parameters of the carbon metal wire's intrinsic carrier mobility and maximum current carrying capacity.

But people don't understand these technical terms at all.

People want to know more about using carbon metal wires to connect the transistors of the chip without changing the process technology.

In the end, how many cores and transistors can be packed compared to before!

In this regard, Lin Xuan did not deliberately get stuck, but looked at people's confused eyes. He directly skipped many links and came to the introduction picture of the chip.

Product name: Hanfeng fourth generation chip

Manufacturing process, 45 nanometer manufacturing process.

Process technology: carbon metal wire interconnection 3D chip stacking technology (5 layers)...

Number of cores: 8 cores

Architecture: The second generation of Hanfeng intelligent architecture

Number of transistors: 3.5 billion!

The Hantang AnTuTu CPU running score is 120159 points, and the GPU running score is 160673 points.

"this……"

Looking at the parameter data of the third-generation chip of Hanfeng displayed on the large projection screen, the scene fell into silence.

"Am I reading this wrong? Are you sure the running score you saw is correct? 120,000 points, surpassing the 42,000 points of the Pingguo mobile phone and the 25,000 points of the Sanxing S1 mobile phone?"

"Yeah, the above should be wrong, and the number of transistors on it should also be wrong.

It is a bit exaggerated to write 3.5 billion. It must be a mistake. It should be 1.5 billion. "

"That's right, Hantang Technology uses a 45-nanometer manufacturing process, and wants to pack 3.5 billion transistors into a chip the size of a fingernail. How can this be possible!"

"That's right, we must have read it wrong, no, it's not that we read it wrong, but the person who made this PPT wrote it wrong!"...

There was a burst of heated discussions at the scene, and people thought that they had read it wrong or thought that this scene was completely a spoof by the person in charge of making the PPT at Hantang Technology.

But then Lin Xuan uttered a sentence, which successfully interrupted their fantasy and brought them back to reality:

"As you can see, our carbon metal wire has an ultra-high intrinsic carrier mobility and the highest current carrying capacity compared to a cobalt metal wire.

So under the same circumstances, our carbon metal wires generate less heat, and have stronger electrical and thermal conductivity, so we can pack more transistors without worrying about heat generation.

The final result is also as you can see, while still using the 45nm process technology.

In a small fingernail chip, we use 5-layer 3D chip stacking technology, which is full of 3.5 billion transistors! "

"Slap!"

In the auditorium in the front row, the disposable paper cup that Jobs held in his hand slammed onto the table in front of him.

The water splashed, and Jobs' clothes were only soaked in an instant.

But at this time, Jobs was still unconscious, and just stared blankly at Lin Xuan, his eyes filled with disbelief!

"This is impossible!"

Next to Jobs, Kuke exclaimed. At this time, he also stared at the above parameters with disbelief in his eyes.

Beside Kuke, a dignified man looked at Lin Xuan above him with complicated eyes.

"3D chip stacking technology, carbon metal wire interconnection technology... What stupid things did I Sanxing do back then!"

Boss Li of Sanxing Electronics looked pained at this time, and he regretted his behavior of cutting off the supply of Hanfeng first-generation chips.

Because if he had been supplying Hanfeng’s first-generation chips, but still OEM mobile phone chips for Hantang Technology, he would not have come to this point now!

Not releasing the raptor of Hantang Technology allowed him to enter the field of chip production, which eventually caused the bitter fruit in front of him!

At this time, Boss Li was very regretful, regretting why he obeyed the orders from Wall Street instead of pushing back forcefully.

If he hadn't done that at the beginning, Hantang Technology might not have entered the field of chip production, and Sanxing would not have competed with Hantang Technology.

It will not be like it is now, launching the terrifying 3D chip stacking technology and carbon metal wire interconnection technology, successfully defeating 14 nanometers with 45 nanometers...

And this is not the limit of Hantang Technology. There is even more terrible news hidden in it. The use of 3D chip stacking technology and carbon metal wire interconnection technology can defeat 14 nanometers.

What if the process technology of Hantang Technology is upgraded to 32nm or 28nm in the future? How will they deal with these 14nm by then?

Increase by 10nm or even 7nm? Can't do it!

14 nanometers has already hollowed out the old Western countries, and it is very difficult to enter 10 nanometers!

And the most frightening thing is that Hantang Technology's mobile phone chip is only superimposed with 5 layers of structure. If one more layer or even two layers is added, how many transistors will be stuffed? !